Dr. Aaron Hutzler will present the latest innovation in reflow profiling of Smd production lines. To avoid voids, solder spatter, oxidation, component displacement and to save maintenance and nitrogen costs, it is not enough to record temperature curves alone. It also includes measuring oxygen concentration and monitoring the transport system in real time during the process.
The seminar is organized by the German printed circuit board association FED, Hamburg chapter. Further information and registration can be found on the FED website: