Individual dimensional adjustment of the housing and modular features to fulfill your requirements
Basic version with temperature, shock and tilt
Flexible upgrades   such as atmospheric oxygen measurement and laser triangulation

Individual adjustments of the housing to fulfill your requirements
Application specific carriers for repeatable measurements
Modular system  for different transport widths

Isolating onion structure enables long operation (patent pending)
Accelerated cooldown for fast repetitive measurements
Lightweight   housing for low interference with the soldering process

Touchless operation control via software for highest comfort
Live display of the temperature profile for in-situ adjustments
Automated  data transfer guarantees safe operation 

Three click software for simple data acquisition
Big data ready interface for individual data mining analysis
Dedicated post processing  module for standard statistics

6 Channel measurement for temperature profiling
Individual carrier systems to compare process capability of different SMT lines
Integration of dummy PCBs to evaluate reflow settings

Transport chain distance measurement to improve parallelism
XYZ forces to assess process handover and machine vibrations
Tilt measurement  to ensure a perfectly leveled process and detect contaminations

Precise measurement from percentage to ppm level to recognize root cause of voiding
O ₂ profiling to detect location of leakages
Cross check of machine sensors to improve process reliabiltiy