The “Omnibus”

Modular datalogger for temperature, mechanical shock, tilt, oxygen, transport parallelism



Omnibus Specification

Low thermal mass
0
Wire-less
0
Thermocouples
0
Mechanical shock sensivity
0
Oxygen up to
0
Transport width
0

MODULAR MULTISENSOR CONCEPT

Basic version with temperature, shock and tilt
Flexible upgrades
  such as atmospheric oxygen measurement and laser triangulation

CuSTOMIZABLE HARDWARE

Individual adjustments of the housing to fulfill your requirements
Application specific
 carriers for repeatable measurements
Modular system
  for different transport widths

INNOVATIVE THERMAL MANAGEMENT

Isolating onion structure enables long operation (patent pending)
Accelerated 
cooldown for fast repetitive measurements
Lightweight 
 housing for low interference with the soldering process

WIRELESS CONNECTION

Touchless operation control via software for highest comfort
Live display 
of the temperature profile for in-situ adjustments
Automated 
 data transfer guarantees safe operation 

USERFRIENDLY SOFTWARE

Three click software for simple data acquisition
Big data ready 
interface for individual data mining analysis
Dedicated post processing  
 module for standard statistics

TEMPERATURE

6 Channel measurement for temperature profiling
Individual carrier
 systems to compare process capability of different SMT lines
Integration 
of dummy PCBs to evaluate reflow settings

TRANSPORT SETTINGS

Transport chain distance measurement to improve parallelism
XYZ forces
 to assess process handover and vibrations
Tilt measurement
   to ensure a perfectly leveled process and detect contaminations

OXYGEN

Precise measurement from percentage to ppm level to recognize root cause of voiding
O
2 profiling to detect location of leakages
Cross check
  of machine sensors to improve process reliabiltiy


Interested? Get in touch with us!